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              MEMs

              ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

              AD8312 Plus Series

              Automatic Die Bonding System (12” wafer handling)

              Eagle AERO

              For High-end IC Applications

              Transfer Molding

              IDEALmold? 3G

              Automatic Encapsulation Solution (strip / reel form substrate handling)

              Transfer Molding Compression Molding

              ORCAS Manual

              Manual Encapsulation Solution

              Compression Molding

              ORCAS Series

              Encapsulation Solution for Large Format Packaging

              Ball Bonder IC Wire Bonding Equipment

              Eagle Xpress GoCu

              High Speed Wire Bonder for Wider Substrate

              Special Wire Bonding Equipment

              Eagle Xpress GoCu with Automated Conveyor System

              High Speed Wire Bonder for Inline Configuration

              Ball Bonder OPTO/LED Wire Bonding Equipment

              Harrier Xtreme

              Dual-Head Extreme High Speed Wire Bonder

              Compression Molding

              IDEALcompress?

              Automatic Encapsulation Solution (strip form substrate handling)

              Transfer Molding

              IDEALmold? R2R

              Encapsulation Solution

              Ball Bonder IC Wire Bonding Equipment

              iHawk Xpress Gocu

              Wire Bonder

              OPTO/LED Wire Bonding Equipment

              iHawk Xpress XL

              Wire Bonder

              Other Applications

              欧美成人