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              Awards & Accolades

              1. February


                Awarded the ASM Assembly Systems awarded the 2020 New Product Introduction (NPI) Award for Component Placement – Accessory Technologies: Siplace SmartFeeder AutoRefill.
                Awarded by Circuits Assembly and Printed Circuit Design and FAB


                Awarded the ASM Assembly Systems awarded the 2020 Innovation Awards for ASM DEK TQ (Category: Assembly Equipment)
                Awarded by IPC


                Recognised ASM Technology Singapore (ATS) as a valued partner in Learning Enterprise Alliance (LEA) 2020.
                Awarded by Institute for Adult Learning Singapore

                January


                Recognized ASM Technology Singapore (ATS) for supporting the Professional Conversion Programme (PCP) in the electronic industry.
                Awarded by the Singapore Semiconductor Industry Association (SSIA), with support from Workforce Singapore.

              2. December


                “Company of the Year 2019” in the SMT category
                Awarded by CIO Review India Magazine


                Hong Kong Corporate Citizenship Award Scheme (Enterprise Category): Merit Award
                Awarded by Hong Kong Productivity Council – HKET


                "Best Innovative Recruitment Campaign Award": Platinum Award
                "Best Office Facilities Award": Platinum Award
                Awarded by CTgoodjobs’ Best HR Awards 2019.



                2019 Junzi Corporate Award
                Awarded by the Hang Seng University of Hong Kong (‘HSUHK’)
                James Chow (Right), EVP for Business Excellence, receiving the 2019 Junzi Corporate Award on behalf of CEO, Lee Wai Kwong.

                November


                "Industrialist Of The Year" Award 2019
                Awarded by Federation of Hong Kong Industries (FHKI)


                ASM Amicra awarded the Productronica Innovation Award 2019 in the Semiconductor Cluster for CoS Die-Bonder
                Awarded by productronica in collaboration with "productronic” magazine at productronica 2019.

                October


                Singapore Quality Award 2019
                Awarded by Enterprise Singapore


                ASM Technology Singapore (ATS) was honored with the Best Practices Award at the EENP Awards 2019.
                Awarded by Energy Efficiency National Partnership (EENP) – A National Environment Agency (NEA) programme.

                September



                Awarded by Asiamoney


                ASM Assembly Systems awarded the “Manufacturing Excellence in Printing Solutions” (Printing Solutions Divisions (DEK)) and “Smart SMT Factory Award” (Placement Solutions Divisions (SIPLACE)).
                Awarded by Electronics Maker Magazine at productronica India 2019 exhibition.


                ASM Assembly Systems's India Sales office awarded the “Excellence in Customer Service Award”
                By Incap Contract Manufacturing Services Pvt. Ltd.

                August


                July


                HKMA Quality Award Grand Award 2019
                Awarded by Hong Kong Management Association

                June


                , "10 BEST Chip Making Suppliers" and "The BEST Assembly and Test Suppliers" from VLSI Customers Satisfaction Survey 2019
                Recieved triple win for a third year. Also awarded in 2018 and 2017.

              3. Recognized as the Top 100 Global Technology Leaders
                Awarded by Thomson Reuters


                Awarded 2018 Factory of the Year/Global Excellence in Operations (GEO) Award in the Excellent Production Network category.
                Honoring Munich (Germany), Weymouth (UK), Singapore and Malaysia ASM Assembly System factories.
                Awarded by Produktion magazine and AT Kearney.
                Also awarded in 2012 and 2016.


                ASM Pacific Technology awarded Singapore Quality Class 2018
                Awarded by Enterprise Singapore


                , "10 BEST Chip Making Suppliers" and "The BEST Assembly and Test Suppliers" from VLSI Customers Satisfaction Survey 2018
                Triple win for a second year. Also awarded in 2017.

              4. ASM Pacific Technology celebrates Third Time Win in Technological Achievement Grand Award 2017
                Awarded by the Hong Kong Awards for Industries (HKIA)
                Also awarded in 1999 and 2015


                ASM ?Pacific Technology won "The Directors of the Year Awards 2017"
                Awarded by The Hong Kong Institute of Directors (HKIoD) and co-organized by The Financial Services and the Treasury Bureau; Securities and Futures Commission and the Hong Kong Exchanges and Clearing Limited


                ASM Pacific Technology named
                Awarded by the Economic Digest


                Honored?with 3 awards - Ranked 1st in Assembly, 10 BEST Chip Making?Suppliers and The?BEST Assembly and Test Suppliers from VLSI Customers Satisfaction Survey 2017


                Awarded one of the “Best Investor Relations Company” and Asia's Best CEO (Investor Relations)
                Awarded?by Corporate Governance Asia


                Ranked Among the 10 BEST Large Semiconductor Equipment Suppliers in the VLSI Customer Satisfaction Survey 2017


                Received 25 Years Supplier Partnership Award
                From Unisem Group


                Received Best Partner Supplier Award
                From Tongfu Microelectronics Co. Ltd.

              5. Awarded the 2016 New Product Introduction (NPI) Awards for Automation Tools: Siplace Bulkfeeder X
                Awarded by Circuits Assembly


                ASM Assembly System's Munich factory was awarded Factory of the Year 2016 Award
                Awarded by Produktion/AT Kearney


                Ranked among the top 10 Hong Kong companies in two categories: “Best Managed Companies” and “Best at Investor Relations”
                Awarded by FinanceAsia


                Ranked among the Top 5 in the VLSI Customer Satisfaction Survey 2016


                Ranked 3rd in the category of Assembly Equipment and 4th in Test Equipment in the VLSI Customer Satisfaction Survey 2016


                2016 Corporate Governance Asia – Best Investor Relations Company


                Received 2015 Supplier Excellence Award (SEA)
                Awarded by Texas Instruments (TI)


                Received the Best FOL Equipment Supplier and Best Quality Supplier awards
                Awarded by Hana Semiconductor (Ayutthaya)


                Received the 2015 Best Supplier award
                Awarded by ASE Group

              6. Awarded the 2015 Technological Achievement Grand Award for Thermo-Compression Bonding (TCB) tool.
                Awarded by the Hong Kong Awards for Industries (HKAI)


                Ranked as the “Top Supplier” by the VLSIresearch

              7. Awarded the "Best Small Cap - Hong Kong" in FinanceAsia's “Asia's Best Companies Poll 2014

              8. SMT Solutions Business honored with the German "Global Excellence in Operations" Award
                Awarded by Produktion magazine and AT Kearney

              9. ATS received the “International Headquarters Award”
                Awarded by the Singapore Economic Development Board

              10. Advanced Packaging Award: Die Equipment and Materials category (MCM12)
                Awarded by Advanced Packaging


                Advanced Packaging Award: Dispensing / Encapsulation / Molding / Underfill Equipment & Materials category (IDEALcompress?)
                Awarded by Advanced Packaging

              11. Named the “2007 Overall Best Managed Company” in Hong Kong in the mid-cap category
                Awarded by AsiaMoney


                Ranked 8th in the “Best Managed Company” in Hong Kong
                Awarded by FinanceAsia


                Ranked top 3 in the “Best Mid-Cap” category
                Awarded by FinanceAsia


                Ranked top 10 for Best Investor Relations and top 5 for Most Committed to a Strong Dividend Policy

              12. Awarded the “Editor’s Choice Best Product” Award (Osprey)
                Awarded by Semiconductor International

              13. Advanced Packaging Award: Dispensing/Encapsulation/Molding/Underfill Equipment & Materials category (Osprey)
                Awarded by Advanced Packaging


                Advanced Packaging Award: Wire Bonding Equipment category (Harrier)
                Awarded by Advanced Packaging


                Advanced Packaging Award: Substrate & Submount Equipment & Materials category (BP2000)
                Awarded by Advanced Packaging

              14. Awarded the “Editor's Choice Best Product” Award (IDEALmold?)
                Awarded by Semiconductor International


                Advanced Packaging Award: Encapsulation/Molding category (IDEALmold?)
                Awarded by Advanced Packaging


                Advanced Packaging Award: Die Attach Equipment and Material category (AD898CC Automatic Die Donder with clean cell system / GA898CC Automatic Glass Bonder)
                Awarded by Advanced Packaging


                Voted one of the Asia’s “Top Ten Best Managed Company in Hong Kong”
                In a survey by FinanceAsia


                Ranked “Top 10 Best Suppliers”
                Awarded by the VLSIresearch

              15. Advanced Packaging Award: Encapsulation/Molding category (IDEALmold? R2R)
                Awarded by Advanced Packaging


                Advanced Packaging Award: Wire Bonding category (Eagle60 Wire Bonder)
                Awarded by Advanced Packaging


                Advanced Packaging Award: Handling Equipment/Handling category (NRTH Test Handler)
                Awarded by Advanced Packaging


                Ranked “Top 10 Best Suppliers” by VLSIresearch

              16. Advanced Packaging Award: Encapsulation/Molding category (IDEALmold? Application for Pinnacle Gating System and Soft Technology)
                Awarded by Advanced Packaging


                Advanced Packaging Award: Die Placement & Attach category (AD8912 Automatic Die Bonder)
                Awarded by Advanced Packaging


                Ranked “Top Supplier” by VLSIresearch

              17. “Editor's Choice Best Products” Award ( AB339 Eagle-Ultra Fine Pitch Gold Wire Bonder)
                Awarded by Semiconductor International


                Ranked “Top 10 Best Suppliers” by the VLSIresearch

              18. Ranked “Top 10 Best Suppliers” by the VLSIresearch


                ASM China ranked as China's top 200 exporters

              19. Conferred the Technological Achievement Award
                Awarded by the Hong Kong Awards for Industries


                Conferred the Technology Achievement Award
                Awarded by the National Science and Technology Board of Singapore

              20. “Editor's Choice Best Products” Award (AB339 Gold Wire Bonder)
                Awarded by Semiconductor International

              21. The Governor’s Award for Hong Kong Design Competition: The Most Technologically Advanced Product Award

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              Occupational Health and Safety Management System

              SS506

              Occupational Health and Safety Management System

              OHSAS 18001

              Occupational Health and Safety Management System

              ISO 9001

              Quality Management System

              IATF 16949

              Quality Management System

              ISO 50001

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              Environmental Management System
              欧美成人